Weekly Bytes | Intel’s $3.5 billion expansion plan, Google’s Entertainment Space, and more

Here's our curated list of important tech news from this week in byte size.

(Subscribe to our Today's Cache newsletter for a quick snapshot of top 5 tech stories. Click to subscribe for free.) Intel said on Monday it will invest $3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including Foveros, Intel’s breakthrough 3D packaging technology. Foveros enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side, providing greater performance in a smaller footprint, the firm said in a release, and added the move from system-on-chip to “system on package” will enable it to meet increasing computing performance needs for artificial intelligence, 5G and the edge. Investing in the company’s manufacturing operations is a key component of . The planning activities begin immediately, with construction expected to start in late 2021, the chipmaker noted. In another development,