Samsung's 8-layer HBM3E chips clear Nvidia's tests for use
The Hindu
Samsung's HBM3E chips pass Nvidia's tests, marking a significant step in the AI processor supply race.
A version of Samsung Electronics' fifth-generation high bandwidth memory (HBM) chips, or HBM3E, has passed Nvidia's tests for use in its artificial intelligence (AI) processors, three sources briefed on the results said.
The qualification clears a major hurdle for the world's biggest memory chipmaker which has been struggling to catch up with local rival SK Hynix in the race to supply the advanced memory chips capable of handling generative AI work.
Samsung and Nvidia have yet to sign a supply deal for the approved eight-layer HBM3E chips but will do so soon, the sources said, adding that they expect supplies would start by the fourth quarter of 2024.
The South Korean technology giant's 12-layer version of HBM3E chips, however, has yet to pass Nvidia's tests, the sources said, declining to be identified as the matter remains confidential.
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Nvidia declined to comment.
In a statement to Reuters, Samsung said that the testing of its products was proceeding as planned, adding that it was "in the process of optimising its products through collaboration with various customers." It did not elaborate further.
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