PM Modi To Lay Foundation Stones Of 3 Semiconductor Facilities Today

These units will employ thousands and catalyse employment generation in related sectors like electronics, telecom, etc.

Prime Minister Narendra Modi will participate in 'India's Techade: Chips for Viksit Bharat' and virtually lay the foundation stones of three semiconductor projects worth nearly Rs 1.25 lakh crore today.

"It has been the vision of the Prime Minister to position India as a global hub for semiconductor design, manufacturing, and technology development, fostering the creation of employment opportunities for the nation's youth. In line with this vision, the foundation stone is being laid for the semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) in Gujarat, the Outsourced Semiconductor Assembly and Test (OSAT) facility in Assam's Morigaon, and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand in Gujarat," the statement read.

The fabrication (fab) facility at the DSIR will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up Semiconductor Fabs in India. With a total investment of over Rs 91,000 crore, this will be the first commercial semiconductor fab in the country.